Display Glossary
III-V SEMICONDUCTOR MATERIALS:
A family of compound semiconductors created from elements in groups III and V of the periodic table. These materials form the foundation of modern LED technology due to their direct bandgap properties that enable efficient light emission. Different combinations of these elements produce LEDs that emit different wavelengths of light, with the following being the most common:
AlGaAs (Aluminum Gallium Arsenide): A III-V semiconductor compound used primarily for red and infrared LEDs with wavelengths from 610 nm to 900 nm. AlGaAs LEDs feature high electron mobility and good thermal stability. The aluminum content determines the bandgap energy, with higher aluminum percentages producing shorter wavelengths. These were among the first commercially viable LEDs but have largely been superseded by more efficient materials for visible light applications
AlInGaP (Aluminum Indium Gallium Phosphide): A quaternary III-V semiconductor compound that serves as the primary material for high-brightness red, orange, and amber LEDs with wavelengths ranging from 570 nm to 650 nm. By adjusting the ratio of aluminum to indium, manufacturers can precisely tune the emission wavelength. AlInGaP LEDs offer excellent efficiency at these wavelengths and maintain good performance at elevated temperatures, making them suitable for automotive lighting and outdoor displays.
InGaP (Indium Gallium Phosphide): A ternary (using three materials) III-V semiconductor used for yellow-green to red LEDs. InGaP has fewer compositional variations than AlInGaP but provides good efficiency in specific wavelength ranges. It features lower forward voltage than AlInGaP counterparts and is often used in applications requiring low power consumption.
InGaN (Indium Gallium Nitride): A III-V semiconductor compound that revolutionized LED technology by enabling efficient blue, green, and now even extended to red wavelengths. The indium content determines the emission wavelength—low indium concentrations produce blue light (450-470 nm), while higher concentrations shift toward green (520-530 nm) and potentially red. InGaN’s wide bandgap and strong crystal structure allow for high current densities, though efficiency typically decreases as wavelength increases into the green spectrum due to increasing lattice mismatch with higher indium content.
GaN (Gallium Nitride): A binary III-V semiconductor with a wide direct bandgap that forms the foundation of blue LED technology. Pure GaN emits in the ultraviolet range, but when used as a base material with InGaN quantum wells, it enables the production of blue and green LEDs. Its thermal and chemical stability makes it ideal for high-power and high-frequency applications.
Active Matrix: Active Matrix displays maintain pixel information at the pixel. This primarily applies to thin film transistor (TFT) displays where each pixel has its own tiny switch (transistor) that controls it independently, creating brighter images with better control than passive systems. This approach allows for faster response times and increasing pixel density.
Bin: A category or group that LEDs are sorted into based on their color, brightness, or other characteristics. Binning helps manufacturers ensure consistency across a display by grouping similar LEDs together.
Binning: The process of testing and sorting LEDs into groups (bins) based on their characteristics like brightness and color. This sorting ensures the display looks uniform even though individual LEDs naturally vary slightly. The binning process categorizes LEDs based on multiple parameters including dominant wavelength (color), luminous flux (brightness), and forward voltage. Manufacturers typically publish binning charts and specifications that detail the exact ranges for each bin. Higher-quality displays often specify tighter binning requirements to ensure visual consistency across the entire display.
Bumper: A rigging header that acts as an interface between the LED panels and the rigging system. This is typically a part that attaches to the top of one or more columns of LED panels.
Cabinet: The physical enclosure that houses sections of an LED display, protecting the internal components and providing structure. Cabinets connect together to form larger displays while keeping the electronics safe from weather and damage. The term frame is also used in this way.
Calibration: Calibration in LED displays is the critical process of measuring and adjusting the LEDs in the display to achieve uniform visual performance across the entire display. This process addresses inherent manufacturing variations and component inconsistencies that would otherwise result in brightness differences and color discrepancies. Using specialized measurement instruments like imaging colorimeters and cameras, calibration systems collect precise data on each LED’s performance characteristics, then generate correction coefficients that are applied either through fixed factory settings or through dynamic real-time processing. The goal is to ensure that every pixel in the display produces the correct brightness and color output, resulting in seamless visual uniformity, accurate color reproduction, and optimal image quality throughout the display’s lifecycle, even as LEDs naturally age and degrade at different rates.
Chip: The LED component that is cut directly from the wafer. This is a semiconductor component that is integrated into an LED package, or placed as a part of an array on a chip on board module. This is the part that creates light when electricity passes through it. In LED displays, a chip is the essential part that converts electrical energy into visible light of specific colors, with different semiconductor materials producing different colored light.
ChipLED: A very small, flat LED package designed for surface mounting on circuit boards. These compact LEDs allow for thinner displays with higher pixel density than traditional LED types.
COB (Chip On Board): A manufacturing technique where multiple LED chips are mounted directly onto a circuit board and covered with a single layer of phosphor. This creates a more unified light source with better color mixing and higher pixel density.
COG (Chip On Glass): A technique where LED chips are mounted directly onto glass substrates instead of circuit boards. Chip on Glass is directly connected to movements towards active matrix LED displays and the introduction of TFTs into large screen LED display.
Color Conversion:
The process of transforming light from one wavelength to another to create different colors from a single light source. In LED displays, this typically involves converting blue or UV LED light to other colors through various mechanisms:
Phosphor Conversion: The most common method, where a phosphor layer absorbs shorter wavelength light (usually blue) and re-emits it at longer wavelengths. YAG:Ce (Cerium-doped Yttrium Aluminum Garnet) is widely used to convert blue light to yellow, which combines with unabsorbed blue light to create white. Red and green phosphors can be added for wider color gamuts.
Quantum Dot Conversion: Semiconductor nanocrystals that absorb light and re-emit it at specific wavelengths determined by the quantum dot size. Smaller quantum dots (2-3nm) emit blue-green light, while larger ones (5-6nm) emit red light. These offer narrower emission spectra than phosphors, resulting in more saturated colors and wider color gamuts. Quantum dots can be incorporated into films, on-chip, or in remote configurations.
Color Gamut:
The range of colors a display can reproduce, typically represented as a percentage of a standardized color space. The calibration of LED displays does not by default guarantee that they conform to any specific color gamut.
Common references include:
Rec.709: Created as part of the HDTV standard the primaries and white point were also adopted as part of the sRGB standard. The standard color space for most digital content, representing about 35% of visible colors.
DCI-P3: A wider color space used in digital cinema, covering approximately 45% of visible colors.
Rec.2020: An ultra-wide color space for UHD content, encompassing about 75% of visible colors.
High-performance LED displays now routinely achieve over 90% of the DCI-P3 color space, with advanced models approaching Rec.2020 standards using narrow-bandwidth emitters such as quantum dots or specialized phosphors.
Color Temperature: A measure of light color from warm (yellowish) to cool (bluish), measured in Kelvin. In LED displays, color temperature affects the overall appearance of white light and influences how natural images appear to viewers.
Common Anode: A LED configuration where all positive terminals (anodes) of multiple LEDs connect to a single power source. This wiring approach simplifies the electrical design for controlling multiple LEDs in a display panel.
Common Cathode: A LED configuration where all negative terminals (cathodes) of multiple LEDs connect to a common ground. This arrangement affects how the display’s control circuitry sends signals to light up specific pixels.
Conformal Coating: A protective, transparent layer applied to circuit boards to shield electronics from moisture, dust, and chemicals. This coating helps outdoor LED displays survive harsh weather conditions and extends their operational lifespan.
Contrast: The difference in brightness between the lightest and darkest parts of an image on the display. Higher contrast makes images appear more vibrant and three-dimensional, especially in bright ambient lighting conditions.
CRT: Cathode Ray Tube, an image is generated by firing an electron beam at phosphor.
https://www.one-electron.com/Archives/GE/GE_TripReports/TripReport-461206-RCA-Lancaster.pdf
Die: The tiny piece of semiconductor material that is the actual light-producing element inside an LED. The die is what converts electricity into light, with different materials producing different colors.
Diode: The basic electronic component that allows electricity to flow in only one direction, with LEDs being specialized diodes that emit light. Every LED in a display contains at least one diode that illuminates when electricity passes through it.
DIP (Dual In-line Package): A traditional LED package style where the LED chip is encased in an epoxy resin with two metal pins extending downward. DIP LEDs create a bulb-like appearance and are commonly used in simpler or larger pixel pitch displays.
Driver: LED drivers are specialized electronic circuits or integrated circuits (ICs) that regulate power to LED devices by providing precise voltage and current control. They serve as the interface between the power source and LEDs, ensuring consistent brightness, preventing damage from current fluctuations, and enabling features like dimming and color control.
As displays manage more pixels, LED driver complexity has increased, with manufacturers like Macroblock, Chipone, and Texas Instruments integrating more functions directly into the driver chips. Modern LED drivers handle functions such as clock management, PWM (Pulse Width Modulation) for brightness control, and current regulation to maintain uniform illumination across many LEDs.
Advanced features in current models include HDR optimization, deep dimming capabilities, and increased scan rates for higher resolution displays, along with energy-saving technologies to improve efficiency.
DSM: Dynamic Scattering Mode relates to the nature of liquid crystal and its function as a light valve. RCA commercialized this function leading to the creation of the LCD display market. DSM in the context of display technology does not mean Diagnostic and Statistical Manual of Mental Disorders and should not be confused with Sound Pattern of English.
Edge Correction: A technique that adjusts the brightness of LEDs at the edges of cabinets to ensure seamless visuals across joined display sections. This correction eliminates visible lines or brightness differences where cabinets meet.
Failure Modes: Visual defects in LED displays that affect image quality. These include but are not limited to:
Dead Pixel: An LED pixel that fails to illuminate at all, appearing as a black spot on the display. This can be caused by electrical connection failures, driver IC malfunction, or LED component failure.
Stuck Pixel: A pixel that remains permanently on or fixed at a specific color regardless of the input signal. Often caused by transistor failures in the driver circuit.
Fang Error: A distinctive failure pattern resembling fangs or teeth where a vertical column or horizontal row of LEDs remains on or off, typically resulting from driver IC failures or connection issues between the driver and the display modules. This pattern follows the scanning circuit path.
Frame: For touring and other applications where the size of the finished walls gets very large it is desirable to integrate multiple LED panels into a frame that allows for both rigging and ground support. These larger frames are largely flown however and therefore the lift is provided via a header/bumper allowing the system to be rapidly installed from carts. By having 2 to 4 panels pre-rigged in the frame the amount of time required for the load in can be reduced.
Frame Rate: The number of complete images (frames) displayed per second, measured in hertz (Hz). Higher frame rates create smoother motion in videos and animations, reducing blur during fast-moving content.
Gamma: Gamma correction in video processing is primarily used to compensate for the non-linear response characteristics of display devices.
The purpose of gamma correction is to optimize the encoding of luminance values to match human visual perception. Our eyes perceive brightness changes logarithmically, not linearly. By applying a gamma curve (where signal = input^gamma), video systems can allocate more digital code values to darker areas where human vision is more sensitive to changes, and fewer to brighter areas where we’re less sensitive.
This encoding approach makes more efficient use of limited bit depth, resulting in perceptually smoother gradients across the entire brightness range. Without gamma correction, we’d need many more bits to achieve the same visual quality, especially in the shadows.
GOB (Glue On Board): A packaging technique where LEDs are directly attached to a circuit board and covered with a protective resin. This approach creates more durable displays that can withstand physical impacts and harsh environments.
Header: A connector on the circuit board that allows data and power cables to be easily attached and detached. Headers facilitate quicker installation and maintenance by providing simple connection points for the display’s internal components. Headers also eliminate cables and this is virtuous and good.
Header: A rigging header that acts as an interface between the LED panels and the rigging system. Offer called a header bar. This is typically a part that attaches to the top of one or more columns of LED panels.
Hub Board: An intermediate circuit board that receives content data and distributes it to different sections of the LED display. The hub board is the physical interface between the LED modules and the receiver card and power supply.
IM : This is another term for an LED Display Module and means “intelligent module” referencing the inclusion of the drivers and some other components within that part.
IMD: This term is typically used to describe 4-in-1 LED packages which arrange a 2 x 2 pixel array on a shared substrate. Multiple companies developed versions of this including AOTO, Apix, Harvatek, and others. The package was also initially referred to as a quad LED package. AOTO illustrated a larger 4 x 4 pixel array and illustrated a key ongoing issue which is the difference between the package to package boundaries and the pixel to pixel boundaries. The first install using the Apix/Harvatek version of this package may be a Hibino project in Tokyo installed in 2015.
LDM (LED Display Module): A self-contained unit containing multiple LEDs primarily arranged in a grid that serves as a building block for larger displays. Modules can be connected together like puzzle pieces to create displays of various sizes and shapes.
LED: An Light Emitting Diode is a “cold light” in the sense that the source of illumination is not thermal. While this series of documents is about modular displays and the use of display technology in entertainment and creative endeavors more broadly the LED is very much at the center of the conversation at the moment.
Oleg Vladimirovich Losev (1903-1942): Oleg Losev, a pioneer of semiconductor photonics, was a self-taught Russian scientist who made groundbreaking discoveries in semiconductor electronics despite working only as a technician and lacking formal education. In the mid-1920s, he observed and systematically documented electroluminescence in silicon carbide crystals, correctly identifying it as “cold light” emission not caused by thermal effects. Losev theorized this was the inverse of the photoelectric effect, effectively inventing the LED decades before mainstream science. He published 43 papers and received 16 patents for his discoveries, including early solid-state amplifiers and oscillators that predated transistors by 25 years.
Tragically, Losev perished during the Siege of Leningrad in 1942. Despite colleagues urging him to evacuate before the Nazi blockade was complete, he refused to leave his laboratory because he was deeply engaged in “promising experiments with silicon” – work that might have led to the discovery of the transistor years before American researchers. His research records were lost during the war, and his contributions remained largely unrecognized in the West for decades. Today, historians acknowledge Losev as the true inventor of the LED and a visionary who glimpsed the semiconductor revolution long before it transformed our world.
The modern industrial process of LED fabrication involves several key steps:
1. Substrate Preparation: Starting with a base material (typically sapphire, silicon carbide, or silicon) that provides the foundation for crystal growth.
2. Epitaxial Growth: Depositing thin crystalline layers of semiconductor materials to form the LED structure, including n-type layer, active region (quantum wells), and p-type layer. This typically occurs in specialized reactors under carefully controlled conditions.
3. Wafer Processing: Applying photolithography techniques to define individual LED dies, depositing metal contacts for electrical connections, and creating surface textures to improve light extraction.
4. Wafer Testing: Conducting electrical and optical tests on the wafer to identify and map performance characteristics and defects before dicing.
5. Dicing: Separating the wafer into individual LED chips using mechanical sawing, laser cutting, or other separation methods.
6. Die Attachment and Packaging: Mounting the LED chip onto a substrate or package, making electrical connections via wire bonding or flip-chip mounting, and applying phosphors if needed for white LEDs.
7. Final Testing and Binning: Testing the completed LEDs for electrical, optical, and thermal performance, then sorting them into bins based on brightness, color, and voltage characteristics.
The LED has been refined over the past one hundred years and now exists as a component in backlights, video projectors, lights, video displays, and those lights in appliances in random hotel rooms that keep us awake at night.
Light Field Displays
A Light Field Display is a specialized three-dimensional display technology that recreates the complete light field emanating from a scene by accurately reproducing the direction, intensity, and wavelength of light rays passing through every point in space. Unlike conventional stereoscopic or autostereoscopic displays that present fixed perspectives, a true light field display must satisfy the following technical requirements:
Core Requirements of a Light Field Display
Plenoptic Function Implementation — The display must implement a practical approximation of the 4D or 5D plenoptic function, which describes light rays by their position in space (x, y, z) and direction (θ, φ).
Angular Resolution — Must provide sufficient angular resolution (typically measured in parallax images per degree or PIPD) to allow smooth transition between perspectives as the viewer moves around the display.
Multiple Simultaneous Viewpoints — Must support multiple viewers simultaneously, with each viewer receiving the correct perspective from their unique position without requiring specialized eyewear.
Natural Visual Cues — Must reproduce all natural visual depth cues, including:
- Binocular disparity (stereopsis)
- Motion parallax that updates accurately with viewer movement
- Proper occlusion relationships between objects
- Correct accommodation (focusing) cues that match convergence
Converging Wavefront Creation — Must generate converging wavefronts of light that reconstruct virtual objects in three-dimensional space, rather than simply displaying multiple discrete 2D views.
Technical Specifications for a Light Field Display
Directional Light Control — Must control the emission direction of individual light rays with sufficient precision to create convincing depth effects.
Resolution Requirements — Must achieve extremely high pixel densities, typically measured in billions of pixels per square meter, to support both spatial and angular resolution needs.
View Zone Parameters — Must define a comprehensive view zone where the 3D effect is properly maintained, with parameters for:
- Horizontal and vertical viewing angles
- Optimal viewing distance range
- Angular sampling density
Depth Reproduction — Must reproduce objects with accurate depth representation both extending into and projecting out from the display surface.
Light Phase and Polarization Control — In its most complete form, a light field display should accurately reproduce the phase and polarization properties of light, allowing physical phenomena such as reflections to behave naturally when viewed through polarized filters (like sunglasses). This advanced characteristic, while not yet fully implemented in most current systems, represents an important aspect of completely faithful light field reproduction.
True light field displays are distinct from:
1. Stereoscopic Displays which only provide two fixed perspectives and require specialized glasses
2. Multi-view Autostereoscopic Displays which provide a limited number of discrete views rather than a continuous light field
3. Volumetric Displays which physically occupy the 3D space they display rather than recreating wavefronts of light
4. Basic Parallax Displays which only simulate limited aspects of the full light field and don’t provide correct accommodation cues
A display that merely claims to be a “light field display” without meeting these essential requirements should not be classified as a true light field display, but rather as an approximation or partial implementation of light field technology.
** Liquid Crystal **: LCD (Liquid Crystal Display) technology operates on a transmissive principle where liquid crystals modulate light from a backlight source rather than generating light themselves. TN (Twisted Nematic) panels, the oldest LCD technology, offer fast response times but limited viewing angles as their liquid crystals twist 90° when voltage is applied. VA (Vertical Alignment) panels provide superior contrast ratios with their perpendicularly aligned crystals that tilt when energized. IPS (In-Plane Switching) panels deliver the best color accuracy and widest viewing angles as their liquid crystals remain parallel to the display surface while rotating horizontally when activated.
The history of LCD technology began with a significant breakthrough in May 1965 when George Heilmeier at RCA Laboratories observed what he called the “dynamic scattering effect,” which required neither dyes nor polarizers. In this configuration, the liquid crystal material started off transparent and then turned milky white when voltage was applied. This Dynamic Scattering Mode (DSM) became the basis for the first operational LCD displays developed by RCA, sparking a worldwide effort to further develop LCD technology.
Backlight technology has evolved from power-hungry CCFL (Cold Cathode Fluorescent Lamps) to energy-efficient LED (Light Emitting Diode) systems, with recent advances including dynamic local dimming zones that can independently adjust brightness for improved contrast. The performance of LCD displays heavily depends on sophisticated film stacks and polarizers that control light diffusion, enhance viewing angles, and manage light polarization to ensure only desired light passes through the liquid crystal layer.
Modern LCD panels utilize TFT (Thin-Film Transistor) architecture, where each pixel has a dedicated transistor allowing precise voltage control and improved image quality, with gate drivers activating rows and source drivers supplying pixel voltages across the display matrix. The manufacturing efficiency of LCD panels has dramatically improved with increasing mother glass sizes, from early Gen 1 (30×40 cm) to today’s massive Gen 10+ (about 3×3 meters) substrates, enabling the production of larger, more affordable displays while reducing material waste.
Louver: Thin slats or fins installed over LEDs to direct light and reduce glare in bright environments. Louvers work like window blinds, improving display visibility by controlling the angle at which light reaches viewers.
Luminance: The measure of brightness that comes from a display surface, measured in nits or candelas per square meter. Higher luminance means a brighter display that can be easily seen even in direct sunlight.
Mask: A material with holes that fits around the LEDs in a display to improve contrast and control viewing angles. The masks are attached to the front of the LED module by adhesive or through a mechanical connection. Some masks are held on with screws.(See Shaders)
Mass Transfer: The manufacturing technique for moving thousands of microscopic LED chips simultaneously from a donor substrate to a display backplane. This critical process for microLED displays involves:
Elastomer Stamp Transfer: Using a soft polymer stamp to pick up arrays of micro-LEDs and place them precisely on the target substrate.
Laser-Assisted Transfer: Employing laser pulses to release micro-LEDs from the growth substrate onto a receiving surface.
Fluidic Assembly: Suspending micro-LEDs in a fluid medium and using electric fields or surface tension to guide them into position.
Leading companies in this technology include PlayNitride, which has developed a mass transfer technology capable of transferring microLEDs with high precision and yield rates, and X Display Company (formerly X-Celeprint), which uses an elastomer stamp-based micro transfer printing process. The efficiency of mass transfer directly impacts microLED display manufacturing cost and we are still at the “brute force” stage of moving these pollen sized emitters around in the factory.
MicroLED: LEDs measured in micrometers that allow for extremely high-resolution displays with superior contrast. MicroLEDs represent the cutting edge of display technology, enabling denser and cheaper screens with better picture quality. The cost reduction is directly tied to the increased number of chips that can be cut from a wafer. Although there is some debate, a MicroLED is generally accepted to be less than 100 microns.
MiniLED: LEDs that are larger than MicroLEDs but smaller than traditional LEDs, offering a middle ground in terms of cost and performance. They are generally between 100-200 microns in size. MiniLEDs provide better contrast than conventional displays while being more affordable than MicroLED technology. Many manufacturers, when evaluating the term that they should use, recognize that one of the X and Y dimensions is under 100 microns and does that make it an honorary MicroLED? Often called MicroLED in the same way that people call things holograms.
MIP (Mxxxxxxx LED In Package): MIP typically stands for “Micro LED In Package,” however this is used as a marketing term and will show up with LED chips that are too large to be microLEDs or be described as “multiple LEDs in package”. MIP is a specialized LED packaging technology where flip chips are transferred to a carrier via mass transfer and then that carrier is cut into individual packages that each integrate a set of chips that form a pixel. These are tested and then packaged independently. And then binned again. For this reason it is possible to get much better performance out of a good MIP screen than a comparable COB screen using the same LED chips. The COB screen will be constrained by the performance of the worst performing LED chips.
The substrates used in MIP technology typically include materials more common in IC packaging and as the technology matures it is easy to see how small driver dies might be packaged along with the LED chips to create active matrix components.
Modular Display: An LED screen built from multiple typically identical sections that can be assembled and disassembled. Modular displays offer flexibility to create different screen sizes and shapes by adding or removing sections as needed.
Module: A small, self-contained section of an LED display containing multiple pixels that can be connected to other modules. Modules work like building blocks that snap together to form a complete display of any desired size. (See LED Display Module)
Moiré: An interference pattern that occurs when two regular patterns overlap with slight differences in alignment or scale. In LED displays, this manifests as wavy lines or distorted patterns that aren’t in the original content. The effect typically occurs when: Camera sensors interact with the pixel structure. Repetitive patterns in the content clash with the display’s pixel arrangement.
Mitigation techniques include anti-moiré filters, software preprocessing of content, optimal camera settings when filming LED screens, and specialized pixel arrangements that reduce regular geometric patterns.
NITS: The common measurement unit for display brightness, equal to one candela per square meter. Higher nit ratings indicate brighter displays that remain visible in brightly lit environments like outdoor settings.
OLED: Organic Light-Emitting Diode technology uses organic materials that emit light when electricity is applied, creating self-illuminating displays that do not require backlights. The first working OLED was invented in 1987 by Ching Tang and Steven Van Slyke at Eastman Kodak, who created a multilayer structure that significantly decreased drive voltage and enabled high luminance—a design still employed in modern OLEDs today. Kodak later sold much of its OLED intellectual property to LG related companies.
There are two different approaches to OLED. The more commercially established branch is referred to as small-molecule OLEDs (SM-OLEDs) and utilizes vacuum deposition techniques to deposit precisely controlled thin films of organic compounds, offering efficient light emission and excellent color purity. This technology dominates commercial OLED production today, being used in virtually all OLED displays on the market. Polymer OLEDs (P-OLEDs), the other branch of development, utilizes larger organic molecules that can be solution-processed through techniques like inkjet printing, potentially enabling lower manufacturing costs, however challenges with efficiency and lifetime compared to SM-OLEDs have hindered the commercial introduction of P-OLED.
Transparent OLEDs allow light to pass through the display when turned off, making them useful for augmented reality, heads-up displays, and retail showcases. Samsung was an early manufacturer of transparent OLED displays but eventually exited this market segment. LG later entered the transparent OLED market and now produces transparent panels for commercial applications, including transparent OLED TVs and digital signage with transparency rates of up to 45%.
Mitsubishi Electric developed the Diamond Vision OLED, a modular display system made from small OLED panels that could be connected to create scalable screens of theoretically unlimited size. Each module measured 384mm × 384mm with a resolution of 128×128, featuring a pixel pitch of 3mm that required viewers to stand a few meters away for optimal viewing. This product did not see broad commercial release.
Package: The protective housing that encases the LED die and its connections, determining its physical characteristics. Different package styles affect how LEDs are mounted, cooled, and protected from environmental damage.
PAM: Pulse Amplitude Modulation
Panel: A larger section of an LED display made up of multiple modules that functions as a single unit. Panels simplify installation by allowing technicians to work with manageable pieces that contain many LEDs already connected together.
Passive Matrix: A simpler display control system where LEDs are arranged in rows and columns without individual transistors and local memory for each pixel. This more basic approach is less expensive but offers lower image quality than active matrix systems.
Pepper’s Ghost: Is not a hologram
Photonic Crystals: Periodic nanostructures that affect the motion of photons similar to how semiconductor crystals affect electrons. In LED applications, photonic crystals serve several purposes:
Light Extraction Enhancement: By altering the photonic density of states, they allow more light to escape from the high-refractive-index semiconductor material.
Directional Emission Control: They can shape the emission pattern of LEDs for specific applications, concentrating light where needed.
Wavelength Filtering: Certain structures can selectively transmit or reflect specific wavelengths, potentially eliminating the need for external filters.
Photonic crystals can be one, two, or three-dimensional and are typically fabricated using nanolithography techniques. When integrated into LED chips or packages, they can improve overall efficiency compared to conventional designs.
Pixel: A Picture-Element. A pixel is the smallest controllable light element in an LED display, typically made up of red, green, and blue sub-pixels that work together to create a single point of color. Pixels are the building blocks that form images on a display, with thousands or millions of them changing colors in coordination to create pictures, videos, and text that we can see.
Pixel Pitch: The distance between the centers of adjacent pixels in a display, usually measured in millimeters. Smaller pixel pitch creates sharper images because the pixels are packed closer together, allowing for more detail.
Potting: The process of filling electronic components with a protective compound that shields them from moisture and vibration. Potting extends the life of outdoor LED displays by creating a waterproof seal around sensitive electronics.
Processor: Modern LED display processors are sophisticated devices that serve as the critical interface between video sources and LED screens. These processors perform multiple complex functions simultaneously: they decode incoming video signals from various formats (HDMI, SDI, DisplayPort), scale content to match the display’s resolution, apply color calibration through LUTs (Look-Up Tables), manage brightness and contrast levels, and coordinate timing signals across multiple panels to create seamless images. These capabilities ensure consistent color accuracy, precise uniformity across large display surfaces, and superior image quality that meets the demands of high-end applications in broadcasting, live events, and permanent installations.
PWM: Pulse Width Modulation
Receiver: The electronic component that accepts signals from the processor and distributes them to the appropriate drivers. A receiver card is an essential electronic component installed within LED display panels or cabinets that serves as the interface between the control system (processor/sender card) and the LED drivers. It receives data from the LED processor via a physical connection and translates these signals into instructions that control individual LED modules.
Receiver cards handle multiple critical functions including pixel mapping, data distribution, color calibration, and module status monitoring. They store configuration information in flash memory about chip types, resolution, scanning methods, and pixel mapping specific to the connected LED modules.
Each LED cabinet typically contains at least one receiver card, which is directly addressed by the LED processor. The performance capabilities of receiver cards vary by manufacturer, with premium models supporting higher pixel counts, faster refresh rates, and advanced color processing.
Refresh Rate: How frequently the display updates its pixel information, measured in hertz (Hz). Higher refresh rates reduce flickering and motion blur, creating smoother-looking video, especially for fast-moving content.
Reflectance: The amount of external light that bounces off the display surface rather than being absorbed. Lower reflectance means less glare and better visibility in bright environments like outdoor settings.
Shader: This is also referred to as a mask and is used to fill in the space between the LED packages on an LED module where one or more shaders may be used. This may also help protect the LED packages and it allows for more control over the surface finish. Louvers, shaders, and masks may be used to differentiate the degree of light traps and physical shading features in the surface of the display with masks having the least prominent light traps and louvers being the most prominent light traps.
SMD (Surface Mount Device): A compact LED package style where components are mounted directly onto the surface of circuit boards. SMD LEDs enable thinner display designs with better color mixing and wider viewing angles than traditional DIP LEDs.
Stereoscopic: Stereoscopic refers to techniques that create the illusion of three-dimensional depth by presenting slightly different images to each eye, mimicking how humans naturally perceive depth through binocular vision. These offset images are processed by the brain to create a perception of depth.
Major Approaches to Stereoscopic Display
Passive Systems
Polarization-based systems use polarizing filters to direct different images to each eye, with viewers wearing inexpensive polarized glasses that filter light based on polarization direction.
Wavelength Division systems like anaglyph displays use color filters (commonly red-cyan, red-blue, red-green, magenta-green, or amber-blue) to separate left and right eye images.
Interference-based systems such as Infitec use sophisticated interference filters that split the visible spectrum into multiple narrow bands for each eye, allowing both eyes to receive all primary colors at slightly different wavelengths.
Active Systems
Active Shutter Glasses synchronize with the display to alternately block vision to each eye while the corresponding image is shown, requiring powered glasses with liquid crystal shutters.
Virtual Reality (VR) headsets place separate displays directly in front of each eye within a head-mounted device, completely immersing the user in a virtual environment.
Augmented Reality (AR)** overlays stereoscopic digital content onto the real world, often through specialized glasses or headsets.
Direction-Controlled Systems
Autostereoscopic displays create 3D effects without requiring special eyewear, often using lenticular lenses or parallax barriers to direct different images to each eye.
Eye-tracking systems like newer Sony displays detect viewer eye positions and adjust the 3D output accordingly to maintain optimal viewing angles and reduce crosstalk.
Backlight-driven systems, as used in the Nintendo 3DS, employ a parallax barrier that can be electrically switched on or off to direct light from LCD pixels selectively to each eye.
Displays such as volumetric displays and the projection mapping of dimensional objects are not precisely stereoscopic in the sense that they have real dimensionality and can manipulate this through content.
TFT: A Thin-Film Transistor is an advanced semiconductor device built by depositing thin layers of materials on a substrate, typically glass. Unlike traditional transistors, TFTs feature an exceptionally thin active layer—often just nanometers thick—allowing them to control electrical current with remarkable precision while maintaining a slim profile. This design makes TFTs ideal for display technologies, where they serve as individual switches in screens, controlling the exact amount of light that passes through each point. The technology revolutionized displays by enabling the bright, high-resolution screens we now rely on daily, from smartphone displays to large television panels, combining compactness with superior performance.
Tile: A pre-assembled section of LED display containing multiple pixels that connects to other tiles to form a larger screen. Tiles work like modular pieces that lock together, allowing for quick assembly and easier maintenance.
Virtual Pixel: A display technique that creates the appearance of higher resolution by blending light from nearby physical pixels. Virtual pixels help displays show smoother curves and more detail than their actual pixel count would normally allow.
Voxel: A Volumetric-Element. A voxel is the smallest addressable sample in a three-dimensional grid, where each tiny cube stores attributes such as opacity, RGB color,, or material ID. Voxels are the building blocks that form volumetric imagery and effects that we can simulate and see on a screen or volumetric display.
Wafer: LEDs are currently predominantly produced on wafers. There are several key materials involved. The wafers interact with specific LED materials to create different color LEDs.
Sapphire Substrate is the most common substrate for LEDs, particularly blue and green LEDs. Sapphire provides better lattice matching (think of this as a description of interference between crystal structures) with GaN than silicon but is more expensive and limited in wafer size.
Silicon Substrate (Si) LEDs face two major technical challenges: approximately 17% lattice mismatch between silicon and GaN (affecting luminous efficiency), and about 54% thermal expansion mismatch (causing cracking when cooling from growth temperatures). The buffer layer between silicon and GaN is crucial for reducing dislocation density and preventing cracks.
Silicon Carbide Substrate (SiC) offers high thermal conductivity (three times higher than silicon) and small lattice mismatch with gallium nitride (only 4%), making it suitable for next-generation LED applications, though challenges remain in producing high-quality, large-size wafers economically.
WIP: Work in Progress, which is what this is.

A curated reference of key terms used in display technology.